AT24C16

AT24C16 , I2C , 2-Wire Serial EEPROM 16Kbits (2048 x 8) EEPROM

Shipping Starts from ₹59
SKU: IC-MEM-AT24C16
Stock Status: 25 pcs
Delivery Status: 3-7 days
₹17.85
Including Tax: ₹2.72
pcs

Description

Description
The AT24C01A/02/04/08A/16A provides 1024/2048/4096/8192/16384 bits of serialelectrically erasable and programmable read-only memory (EEPROM) organized as128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in manyindustrial and commercial applications where low-power and low-voltage operationare essential. The AT24C01A/02/04/08A/16A is available in space-saving 8-leadPDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 5-lead SOT23(AT24C01A/AT24C02/AT24C04), 8-lead TSSOP, and 8-ball dBGA2 packages and isaccessed via a Two-wire serial interface. In addition, the entire family is available in2.7V (2.7V to 5.5V) and 1.8V (1.8V to 5.5V) versions.

The AT24C16A does not use the device address pins, which limits the number of
devices on a single bus to one. The A0, A1 and A2 pins are no connects and can be
connected to ground.

AT24C16A, 16K SERIAL EEPROM: Internally organized with 128 pages of 16 bytes
each, the 16K requires an 11-bit data word address for random word addressing.

Datasheet: Download

.Features

  • Low-voltage and Standard-voltage Operation–  
  •      2.7 (VCC = 2.7V to 5.5V)–  1.8 (VCC = 1.8V to 5.5V)
  • Internally Organized
  •        128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K),1024 x 8 (8K) or 2048 x 8 (16K)
  •   Two-wire Serial Interface
  • Schmitt Trigger, Filtered Inputs for Noise Suppression
  • Bidirectional Data Transfer Protoco
  • 100 kHz (1.8V) and 400 kHz (2.7V, 5V) Compatibility
  • Write Protect Pin for Hardware Data Protection
  • 8-byte Page (1K, 2K), 16-byte Page (4K, 8K, 16K) Write Modes
  • Partial Page Writes Allowed
  • Self-timed Write Cycle (5 ms max)
  • High-reliability–  Endurance: 1 Million Write Cycles
  • –  Data Retention: 100 Years
  • Automotive Devices Available
  • 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 5-lead SOT23, 8-lead TSSOP and 8-ball dBGA2 Packages
  • Die Sales: Wafer Form, Waffle Pack and Bumped Wafers

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